DUBLIN–(BUSINESS WIRE)–The “Thin Film Encapsulation Market – Growth, Trends, COVID-19 Impact, and Forecasts (2021 – 2026)” report has been added to ResearchAndMarkets.com’s offering.
Thin Film Encapsulation (TFE) is an emerging and evolving form of technology for organic light-emitting diodes (OLED) and is expected to grow at a CAGR of 14.8% during the forecast period 2021-2026 .
Companies Mentioned
Samsung SDI LG Chem Universal Display Corp. (UDC) Applied Materials Inc. Veeco Instruments Inc. 3M Toray Industries Inc. Kateeva BASF (Rolic) AG Meyer Burger Technology Limited AMS Technologies Bystronic Glass Aixtron SE Angstrom Engineering Inc. Lotus Applied Technology Beneq Inc. Key Market Trends
Flexible OLED Display Segment is Poised to Register the Highest Growth Rate in the Thin Film Encapsulation Market
The Flexible organic light-emitting diode (OLED) will be the most advanced display technology to buyers and industries in the near future. Thin-film encapsulation (TFE) technology is the most utmost demanding necessity to prevent water and oxygen penetration into flexible OLED devices. As a polymer substrate does not offer the identical barrier performance as glass, the TFE development on both the bottom and top side of the device layers for adequate lifetimes. With excellent display quality such as perfect video capability, vivid full color, and thin form factor, AMOLED (active-matrix organic light-emitting diode) is making its progress into OLED TV (television), mobile devices and smartwatches are poised to access into consumer markets in the near future. AMOLED on flexible substrates would be considered as the ultimate display because of its ruggedness and versatility. Though, there are a number of hurdles to realizing flexible AMOLED, particularly on plastic substrates. Among these difficulties, TFE is the most demanding task because OLED demands the greatest degree of protection from moisture and oxygen penetration in electronic gadgets. OLED technologies are persistently meeting the demands of customers and markets. The success of flexible OLED applications still needs further advancements in the technology of TFE. Numerous barrier architectures are possible and each technology has distinctive materials, processing, and barrier characteristics. The principal benefit of this approach is that it can obtain low WVTR (water vapor transmission rate) with fewer layers because ALD/MLD layers have much more satisfying film integrity, but the disadvantage has been the low throughput and restraint in the scalability of the MLD/ALD process. Therefore, a greater knowledge of the synergistic effect of polymer/inorganic multilayers (Vitex Technology) may lead to enhanced barrier performance from simplistic structures but there are still problems to make practically the TFE on large area/flexible OLED application. Hence, a novel ALD and/or MLD system (Synos Technology) will give a big breakthrough and opportunity of TFE in the OLED industry. Asia-Pacific Expected to Witness the Highest Growth Rate
Asia-Pacific accounted for the most notable market share in the thin-film encapsulation market. The growth of the regional market can be associated with the progression of electronics and semiconductor industries, mainly in China. The deep-rooted electronics manufacturing bases in South Korea, China, and Taiwan led to an enhanced demand for thin film encapsulation technologies. Moreover, in a region, which has a bunch restrictive regulatory policies on FDI across the industries, according to the Economic Outlook for Southeast Asia, China, and India 2018: Fostering Growth through Digitalisation report by OECD 2018, the electronics-manufacturing area is more open to FDI, compared with the national averages for all the sectors merged. Government policies have supported the establishment of the dynamic electronics industry in the area. The increase in industrialization and an addition in the number of end-user industries in developing economies, such as China and India, have offered various untapped opportunities. Moreover, China, Indonesia, South Korea, Japan, and Taiwan have led the thin-film encapsulation market growth, due to growing solar panel manufacturing and installations. Key Topics Covered:
1 INTRODUCTION
2 RESEARCH METHODOLOGY
3 EXECUTIVE SUMMARY
4 MARKET DYNAMICS
4.1 Market Overview
4.2 Introduction to Market Drivers and Restraints
4.3 Market Drivers
4.3.1 Increase in Demand for Microelectronics and Consumer Electronics Products
4.3.2 Increased Adoption of Flexible OLED Displays for Smartphones and Smart Wearables
4.4 Market Restraints
4.4.1 High Capital Investment in R&D for Developing Upgraded Products
4.4.2 Augmented Growth of Flexible Glass
4.5 Industry Attractiveness – Porter’s Five Force Analysis
5 MARKET SEGMENTATION
5.1 By Technology
5.1.1 Plasma-enhanced chemical vapor deposition (PECVD)
5.1.2 Atomic layer deposition (ALD)
5.1.3 Inkjet Printing
5.1.4 Vacuum Thermal Evaporation (Vte)
5.1.5 Other Technologies
5.2 By Application
5.2.1 Flexible OLED Display
5.2.2 Thin-Film Photovoltaics
5.2.3 Flexible OLED Lighting
5.2.4 Other Applications
5.3 Geography
5.3.1 North America
5.3.2 Europe
5.3.3 Asia Pacific
5.3.4 Rest of the World
6 COMPETITIVE LANDSCAPE
6.1 Company Profiles
7 MARKET OPPORTUNITIES AND FUTURE TRENDS
8 INVESTMENT ANALYSIS
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