SEOUL, South Korea–(BUSINESS WIRE)–Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today introduces its newest radio frequency (RF) technology based on 8-nanometer (nm) process. This cutting-edge foundry…
June 03, 2021 12: 54 AM Eastern Daylight Time SEOUL, South Korea–(BUSINESS WIRE)–Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it received the industry’s…
May 26, 2021 10: 00 PM Eastern Daylight Time SEOUL, South Korea–(BUSINESS WIRE)–Samsung Electronics Co., Ltd., a world leader in advanced digital component solutions, today introduced the LM301B EVO, a…
RIDGEFIELD PARK, N.J.–(BUSINESS WIRE)–Samsung Electronics America, Inc. announced today the three grand prize National Winners in the 11th annual Samsung Solve for Tomorrow Contest – a $2 millionnational competition that…
SEOUL, Korea–(BUSINESS WIRE)–Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the industry’s first integrated power management ICs (PMICs) — S2FPD01, S2FPD02 and S2FPC01, for the…
Bitmain, one of the largest application-specific integrated circuit (ASIC) manufacturers in the world, is reportedly working with the Taiwan Semiconductor Manufacturing Company (TSMC) in order to leverage TSMC’s 5nm semiconductors.…
Galaxy owners will be able to connect hardware wallets to their smartphones and transfer coins to the built-in wallet that comes with most devices in the popular lineup. Samsung says…
Samsung issued an official announcement to inform users that they will now be able to manage and trade cryptocurrencies from third-party wallets directly on Samsung Galaxy smartphones. This update will…
SEOUL, South Korea–(BUSINESS WIRE)–Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today unveiled the industry’s first memory module supporting the new Compute Express Link (CXL) interconnect standard.…
SEOUL, South Korea–(BUSINESS WIRE)–Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the immediate availability of its next-generation 2.5D packaging technology Interposer-Cube4 (I-Cube4), leading the evolution…