PARIGI e WALTHAM, Mass.–(BUSINESS WIRE)–Echosens, una società a elevato livello tecnologico che propone la serie di prodotti FibroScan, oggi annuncia che eminenti ricercatori presenteranno studi a supporto del valore di…
DUBLIN–(BUSINESS WIRE)–The “Emerging Semiconductor Substrate Market Report: Trends, Forecast and Competitive Analysis” report has been added to ResearchAndMarkets.com’s offering. The future of the global emerging semiconductor substrate looks attractive with…
Image Source: Image by WorldSpectrum from Pixabay Bitcoin and other decentralized currencies are firmly making their way into almost every industry and the same is true within the world of…
NEW YORK–(BUSINESS WIRE)–Morgan Stanley Investment Management (MSIM) and the Multicultural Strategy Group today announced it has launched Morgan Stanley Next Level Fund, L.P. (“Next Level” or the “Fund”). The Fund,…
PHILADELPHIA–(BUSINESS WIRE)–Gopuff is joining the White House’s National Action Month, the nation-wide campaign to get eligible Americans vaccinated. Gopuff is offering $100,000 in Gopuff credits for select community college and…
SAN FRANCISCO–(BUSINESS WIRE)–SingleStore, the world’s fastest unified database for data-intensive applications, today announced the availability of the only database in the industry that addresses both analytical and transactional workloads for…
HILLSBORO, Ore.–(BUSINESS WIRE)–Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced availability of the latest version of its popular software design tool for use with low power…
HILLSBORO, Ore.–(BUSINESS WIRE)–Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today launched the Lattice CertusPro™-NX general purpose FPGA family. As the fourth device family based on the Lattice…
SEATTLE–(BUSINESS WIRE)–Echodyne, the radar platform company, announced today substantial enhancements to its industry-leading radars, adding a new radar for international markets, a new product for special operations-type applications, a ruggedized…
VENTURA, Calif.–(BUSINESS WIRE)–Ultrafast 3D printing pioneer, Nexa3D, was awarded “Best in Class” for machines in processes at the Innovations Awards at the AM Tech Forum on June 17, 2021. The…